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hlmp-ag62/ag63, ah62/ah63, al62/al63 hlmp-hg62/hg63, hh62/hh63, hl62/hl63 5mm mini oval and standard oval alingap leds data sheet description these precision optical performance alingap oval leds are specifi cally designed for full color/video and passenger information signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide fi eld of view outdoor ap- plications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains both uv-a and uv-b inhibitors to reduce the eff ects of long term exposure to direct sunlight. applications ? full color signs features ? viewing angle: 30x70 and 40x100 ? colors: 590nm amber 615nm red-orange 626nm red ? well defi ned spatial radiation pattern ? high brightness material ? superior resistance to moisture ? package options: stand-off and non stand-off leads ? tinted and diff used
2 package drawing b for 5mm standard oval 40x100 package drawing c package drawing d notes: all dimensions in millimeters (inches). package dimensions for 5mm mini oval 30x70 package drawing a 5.20 0.20 0.205 0.008 8.70 0.20 0.342 0.008 2.54 0.3 0.100 0.012 1.00 0.038 3.80 0.200 0.150 0.008 min. 0.8 0.032 cathode lead 24.00 0.945 0.50 0.10 0.020 0.004 1.50 0.15 0.0591 0.006 11.70 0.50 0.4606 0.020 sq. typ. 8.70 0.20 0.342 0.008 5.20 0.200 0.205 0.008 24.00 0.945 0.70 0.028 0.8 0.032 0.50 0.10 0.020 0.004 sq. typ. 2.54 0.3 0.100 0.012 1.00 0.038 min. cathode lead max. max. max. min. min. 0.70 0.028 max. 3.80 0.200 0.150 0.008 10.800.50 0.4250.020 1.500.15 0.0590.006 1.00 0.039 24.00 0.945 cathode lead 0.500.10 0.0200.004 3.80 0.150 7.00 0.276 5.20 0.205 1.02 0.040 2.540.30 0.100.012 sq. typ. 1.02 0.040 0.50 0.10 .020 .004 3.80 0.150 5.20 0.205 7.00 0.276 25.00 0.984 0.70 .028 1.00 .039 2.54 0.10 sq. typ. cathode lead max. max. min. min. max. min. min.
3 device selection guide 5mm mini oval 30x70 part number color and dominant wavelength d (nm) typ. luminous intensity iv (mcd) at 20 ma min. luminous intensity iv (mcd) at 20 ma max. stand-off package drawing hlmp-al62-ux0dd amber 590 960 1990 no a hlmp-al62-x10dd amber 590 1660 3500 no a hlmp-ah62-ux0dd red-orange 615 960 1990 no a hlmp-ah62-x10dd red-orange 615 1660 3500 no a hlmp-ag62-ux0dd red 626 960 1990 no a hlmp-ag62-x10dd red 626 1660 3500 no a hlmp-al63-ux0dd amber 590 960 1990 yes b hlmp-al63-x10dd amber 590 1660 3500 yes b hlmp-ah63-ux0dd red-orange 615 960 1990 yes b hlmp-ah63-x10dd red-orange 615 1660 3500 yes b hlmp-ag63-ux0dd red 626 960 1990 yes b hlmp-ag63-x10dd red 626 1660 3500 yes b 5mm standard oval 40x100 part number color and dominant wavelength d (nm) typ luminous intensity iv (mcd) at 20 ma min. luminous intensity iv (mcd) at 20 ma max. stand-off package drawing hlmp-hl62-tx0dd amber 590 800 1990 no c hlmp-hh62-tx0dd red-orange 615 800 1990 no c HLMP-HG62-TX0DD red 626 800 1990 no c hlmp-hl63-tx0dd amber 590 800 1990 yes d hlmp-hh63-tx0dd red-orange 615 800 1990 yes d hlmp-hg63-tx0dd red 626 800 1990 yes d notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. tolerance for each intensity limit is 15%. 3. please refer to an 5352 for detail information on features of stand-off and non stand-off leds.
4 part numbering system hlmp- x x 62/63 - x x x x x packaging option dd: ammopacks color bin selection 0: open distribution maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide. color g: red 626nm h: red orange 615nm l: amber 590nm package a: 5mm mini oval 30 x 70 h: 5mm standard oval 40x100 absolute maximum ratings t a = 25c parameter value unit dc forward current [1] 50 ma peak forward current 100 [2] ma power dissipation 120 mw reverse voltage 5 (ir = 100 a) v led junction temperature 130 c operating temperature range -40 to +100 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor 30%, frequency 1khz. note: please refer to ab 5337 for complete information on part numbering system.
5 electrical / optical characteristics t a = 25c parameter symbol min. typ. max. units test conditions forward voltage amber red red-orange v f 1.8 2.2 2.1 2.0 2.4 v i f = 20 ma reverse voltage v r 5v i r = 100 a dominant wavelength [1] amber red red-orange d 584.5 620 612 594.5 630 621.7 nm i f = 20 ma peak wavelength amber red red-orange peak 590 626 615 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-anode lead luminous effi cacy [2] amber red red-orange v 480 150 260 lm/w emitted luminous power/emitted radiant power notes: 1. the dominant wavelength is derived from the chromaticity diagr am and represents the color of the lamp. tolerance for each co lor of dominant wavelength is 0.5nm. 2. the radiant intensity, ie in watts per steradian, may be found from the equation ie = iv/ v where i v is the luminous intensity in candelas and v is the luminous effi cacy in lumens/watt. figure 1. relative intensity vs. peak wavelength
6 figure 5. representative radiation pattern for 30x70 lamp -major axis figure 2. forward current vs. forward voltage figure 4. maximum forward current vs. ambient temperature figure 3. relative luminous intensity vs. forward current 0 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 3 forward voltage - v forward current - ma amber red-orange red 0 0.5 1 1.5 2 2.5 0 1020 3040 50 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 5 10 15 20 25 30 35 40 45 50 55 0 20 40 60 80 100 12 0 t a - ambient temperature - oc i f - forward current - ma 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity figure 7. representative radiation pattern for 40x100 lamp -major axis figure 6. representative radiation pattern 30x70 lamp -minor axis 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity
7 intensity bin limit table (1.2: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 tolerance for each bin limit is 15% vf bin table (v at 20ma) bin id min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 tolerance for each bin limit is 0.05v amber color bin limits bin min max 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 tolerance for each bin limit is 0.5nm. figure 9. relative light output vs junction temperature figure 8. representative radiation pattern 40x100 lamp Cminor axis 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity 0.1 1 10 -50 -25 0 25 50 75 100 125 150 junction temperature - c relative lop (normalize at 25 c ) amber red-orange red
8 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be eff ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip 1.59mm closer than 1.59mm might damage the led. ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note: 1. above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2. it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profi le to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with diff erent size and design (component density) will have diff erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profi le again before loading a new type of pcb. 2. avago technologies high brightness led are using high effi ciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confi guration anode note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fi xture that is being applied during wave soldering should be loosely fi tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. note: in order to further assist customer in designing jig accurately that fi t avago technologies product, 3d model of the product is available upon request. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fi xture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refl ow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause diffi culty inserting the th led
9 example of wave soldering temperature profi le for th led ammo packs drawing 0 30 40 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting temperature (c) 10 20 60 70 80 50 mechanical force. 6.351.30 0.250.0512 12.701.00 0.500.0394 20.501.00 0.80710.0394 4.000.20 0.15750.008 0.700.20 0.02760.0079 12.700.30 0.500.0118 9.1250.625 0.35930.0246 18.000.50 0.70870.0197 typ ? view a - a a a cathode
10 packaging box for ammo packs label on this side of box from left side of box adhesive tape must be facing upwards. anode lead leaves the box first. note: for ingan device, the ammo pack packaging box contain esd logo packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id: deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c
disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main- tenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its sup- pliers, for all loss, damage, expense or liability in connection with such use. acronyms and defi nition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only (1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2011 avago technologies. all rights reserved. av02-1314en - april 19, 2011

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